RF DSP BOARD
This is a mixed signal design with both high speed digital and RF circuits. It utilizes a TI DSP (532 pin BGA), and a Lattice FPGA to perform RF signal processing functions. It has two high speed ADC and DAC channels for RF I/O. With a BGA pitch of 0.8 mm (31.5 mils) and the desire to isolate the digital from the RF circuitry, the board stack-up required the use of 12 layers and blind vias.
TOP ASSEMBLY DRAWING